Material extrusion (MEX) has developed greatly since its invention in the early 1990s. Currently, there is a lot of focus on developing and improving in-situ monitoring methods for 3D printing using various technologies. One of the monitoring modalities that has become available with conductive filaments is the resistive qualities of the 3D-prints.
I will present a design of an Electrical Impedance Tomography (EIT) measurement method that can be used to map the resistance distribution in 3D-printed objects. I will introduce some of the techniques used in this design, explain several possible improvements and discuss how this design may be implemented for use in 3D printing.